Blown film production boost with new die head from W&H

Comptoir National du Plastique (CNP) in Tunisia increases production of its blown film line by 20% with a retrofit from W&H

Сase studies

Improving tolerances by 30% and achieving faster startups with EDI® Automatic Die from Nordson

Nordson's Autoflex™ VI-RE die yields more uniform film, enhancing the printing and heat shrinking processes used for labels in packaging

New Issue

22.07.2026

Extrusion 5-2026

News

News 05.02.2020

Chinaplas 2020 plastics trade show postponed

Adsale Exhibition Services will announce new dates for the show later

News 05.02.2020

Solvay completes divestment of polyamides

BASF will acquire all the Performance Polyamides activities of Solvay that are not acquired by Domo Chemicals and that are part of the original agreement between Solvay and BASF

News 04.02.2020

Albis strengthens product development capabilities in North America

As a result the company is now also developing compounds locally for the North American market at their manufacturing site in Duncan, SC.

News 04.02.2020

Victrex to create a joint-venture for PEEK manufacture in China

Development of PEEK polymer capacity in China sets the stage for further regional growth opportunities and further differentiates Victrex’s range of PEEK & PAEK grades

News 04.02.2020

Placon’s Crystal Seal® reFresh® Parfait Line

The new line is made of 75% or more of Placon’s EcoStar® post-consumer PET material and is 100% recyclable

News 04.02.2020

Davis-Standard to showcase TPE tubing and ABS filament line at MD&M West 2020

The line will demonstrate processing versatility by running TPE tubing on the first two days of the show and ABS filament on day three

News 31.01.2020

Dow and Avangard Innovative advance plastic circularity

Dow to combine its virgin polyethylene resins with Avangard Innovative’s pellets made from post-consumer resin (PCR) plastic film

News 31.01.2020

GeoTrans™ extrusion technology from Trelleborg

Using High Consistency Rubber (HCR) silicone, this process reduces total cost of ownership for the device manufacturer by removing the risks and labor of assembly and secondary processes